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Responsibilities include lead
person of the microelectronic lab familiar with microelectronic processes, works
with microelectronic equipment used for substrate/die attach process, wire bond
process, rework process, environmental testing, and seam sealing. Includes
supporting section head on manpower forecasting, day-to-day lab support role,
prepares both technical reports and documentation, and prepares bid estimates.
Includes supporting engineers on evaluating new circuit design on packaging
options and/or assembly processes. Candidates must have a BS/MS in computer
engineering or mechanical engineering, plus five years working experience.
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